COOLING SYSTEM DESIGNING FOR HPC

RAKOTOARISOA Hasina Patrick; RATSIMBA Mamy Nirina; RASTEFANO Elisée

COOLING SYSTEM DESIGNING FOR HPC

February 2019

Vol-5, Issue-1

Paper ID: 9502

ISSN: 2395-4396

Downloads: 0

Abstract & Details

Research Area

HPC, Computer Engineering

Keywords

TDP (Thermal Design Power) HPC design of cooling system clock frequency CPU

Abstract

Energy consumption is a big problem in HPC (High Performance Computing). The cooling system plays dual role in HPC. Not only does it consume energy, but also it keeps electronic components in the appropriate functioning conditions. So the design of a cooling system is very important in HPC. The size of the cooling system to be used in an HPC is function of the clock frequency of the CPU (Central Point Unit). From this expression, we can have the TDP (Thermal Design Power) of one processor and also that of a HPC. The correct temperature of HPC cooling can be obtained from TDP.

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Author Information

#	Name	Institute / Affiliation
1	RAKOTOARISOA Hasina Patrick	Doctoral School of Science and Technics of Engineering and Innovation
2	RATSIMBA Mamy Nirina	Doctoral School of Science and Technics of Engineering and Innovation
3	RASTEFANO Elisée	Doctoral School of Science and Technics of Engineering and Innovation

How to Cite

Use the following formats to cite this article in your research.

APA Style

Patrick, RAKOTOARISOA Hasina, Nirina, RATSIMBA Mamy, & Elisée, RASTEFANO (2019). COOLING SYSTEM DESIGNING FOR HPC. International Journal of Advance Research and Innovative Ideas In Education, 5(1), 577-582.

MLA Style

Patrick, RAKOTOARISOA Hasina, et al. "COOLING SYSTEM DESIGNING FOR HPC." International Journal of Advance Research and Innovative Ideas In Education, vol. 5, no. 1, 2019, pp. 577-582.

IEEE Style

RAKOTOARISOA Hasina Patrick, RATSIMBA Mamy Nirina, and RASTEFANO Elisée, "COOLING SYSTEM DESIGNING FOR HPC," International Journal of Advance Research and Innovative Ideas In Education, vol. 5, no. 1, pp. 577-582, 2019.

Vancouver Style

Patrick RAKOTOARISOA Hasina, Nirina RATSIMBA Mamy, Elisée RASTEFANO. COOLING SYSTEM DESIGNING FOR HPC. International Journal of Advance Research and Innovative Ideas In Education. 2019;5(1):577-582.

Harvard Style

Patrick, RAKOTOARISOA Hasina, Nirina, RATSIMBA Mamy, & Elisée, RASTEFANO (2019) 'COOLING SYSTEM DESIGNING FOR HPC', International Journal of Advance Research and Innovative Ideas In Education, 5(1), pp. 577-582.

Chicago Style

Patrick, RAKOTOARISOA Hasina, RATSIMBA Mamy Nirina, and RASTEFANO Elisée. "COOLING SYSTEM DESIGNING FOR HPC." International Journal of Advance Research and Innovative Ideas In Education 5, no. 1 (2019): 577-582.

Turabian Style

Patrick, RAKOTOARISOA Hasina, RATSIMBA Mamy Nirina, and RASTEFANO Elisée. "COOLING SYSTEM DESIGNING FOR HPC." International Journal of Advance Research and Innovative Ideas In Education 5, no. 1 (2019): 577-582.