DESIGN OF LIQUID COOLING FOR HIGH HEAT DISSIPATION ELECTRONIC BOARDS USING CFD

Mechanical Engineering

The current trend of miniaturization and higher performance of electronic devices demands cost-effective cooling solutions capable to dissipate increasingly larger heat fluxes. Several technological challenges exist in the fields of materials, manufacturing, packaging and thermal management of high-power electronics. Conventional cooling technologies, such as natural and forced convection of air in heat sinks, are limited to meet the cooling requirements of new generation high-power electronics boards used for high end applications. Liquid-cooling is a promising thermal management method, where larger heat transfer coefficients may be achieved due to the intrinsic thermo physical properties of liquid coolants in combination with larger heat transfer areas achieved through small flow passages. In this work a liquid cooling channel is designed for the high dissipation microprocessor board which is not cooled by conventional fan/air cooling. The liquid channel is designed and optimized using CFD for different parameters like mass flow rate and channel sizes.

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