CFD ANALYSIS OF HEAT SINK FOR PCM

HEAT SINK

Heat dissipation techniques are the prime concern to remove the waste heat produced by Electronic Devices, to keep them within permissible operating temperature limits. Heat dissipation techniques include heat sinks, fans for air cooling, and other forms of cooling such as liquid cooling. Heat produced by electronic devices and circuitry must be dissipated to improve reliability and prevent premature failure. Integrated circuits such as CPUs, chipset, graphic cards, and hard disk drives are susceptible to temporary malfunction or permanent failure if overheated. As a result, efficient cooling of electronic devices remains a challenge in thermal engineering. The main objective of this paper is to reduce the temperature distribution of the heat sink. The CFD analysis is carried out for the heat sink to predict the temperature distribution. Paraffin Wax is used as a Phase Change Material (PCM) due to its latent heat storage capacity. The CFD analysis is carried under two cases, one is heat sink with using PCM another one is without using PCM. The comparative values of temperature is predicted for both the cases.

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