REVIEW OF HEAT TRANSFER ENHANCEMENT OF HEAT SINK USING PLATE AND PIN FINS

January 2016
Vol-2, Issue-1
Paper ID: 1569
ISSN: 2395-4396
Downloads: 0

Abstract & Details

Research Area
MECHANICAL (THERMAL) ENGINEERING
Keywords
Heat sink Fins Aspect ratio Material Pressure drop Direct and Indirect techniques Convection
Abstract
Heat sinks are widely employed in electronics industries for lowering the temperature to avoid any damage of integrated circuits and improve its overall performance. Fins play key role in heat sinks. The various geometrical aspects of the fin as well as material properties plays vital role in heat transfer rate. These properties should be optimized to obtain maximum possible thermal efficiency. Lot of researches are done by researchers to obtain the relation between various thermodynamic properties such as heat, temperature gradient due to ambient conditions. The heat transfer is enhanced by optimising the geometrical aspects of the heat sink. As the geometrical aspects have higher impact on overall results.

Author Information

# Name Institute / Affiliation
1 RAM NIVAS MATHUL PVPIT, SANGLI
2 Mr. S. R. Patil PVPIT, SANGLI
3 Mr. Kasekar R. M. RSIET, CHIPLUN
4 Mr. Shevale N. P. RSIET, CHIPLUN

How to Cite

Use the following formats to cite this article in your research.

APA Style
MATHUL, RAM NIVAS, Patil, Mr. S. R., M., Mr. Kasekar R., & P., Mr. Shevale N. (2016). REVIEW OF HEAT TRANSFER ENHANCEMENT OF HEAT SINK USING PLATE AND PIN FINS. International Journal of Advance Research and Innovative Ideas In Education, 2(1), 224-228.
MLA Style
MATHUL, RAM NIVAS, et al. "REVIEW OF HEAT TRANSFER ENHANCEMENT OF HEAT SINK USING PLATE AND PIN FINS." International Journal of Advance Research and Innovative Ideas In Education, vol. 2, no. 1, 2016, pp. 224-228.
IEEE Style
RAM NIVAS MATHUL, Mr. S. R. Patil, Mr. Kasekar R. M., and Mr. Shevale N. P., "REVIEW OF HEAT TRANSFER ENHANCEMENT OF HEAT SINK USING PLATE AND PIN FINS," International Journal of Advance Research and Innovative Ideas In Education, vol. 2, no. 1, pp. 224-228, 2016.
Vancouver Style
MATHUL RAM NIVAS, Patil Mr. S. R., M. Mr. Kasekar R., P. Mr. Shevale N.. REVIEW OF HEAT TRANSFER ENHANCEMENT OF HEAT SINK USING PLATE AND PIN FINS. International Journal of Advance Research and Innovative Ideas In Education. 2016;2(1):224-228.
Harvard Style
MATHUL, RAM NIVAS, Patil, Mr. S. R., M., Mr. Kasekar R., & P., Mr. Shevale N. (2016) 'REVIEW OF HEAT TRANSFER ENHANCEMENT OF HEAT SINK USING PLATE AND PIN FINS', International Journal of Advance Research and Innovative Ideas In Education, 2(1), pp. 224-228.
Chicago Style
MATHUL, RAM NIVAS, et al. "REVIEW OF HEAT TRANSFER ENHANCEMENT OF HEAT SINK USING PLATE AND PIN FINS." International Journal of Advance Research and Innovative Ideas In Education 2, no. 1 (2016): 224-228.
Turabian Style
MATHUL, RAM NIVAS, et al. "REVIEW OF HEAT TRANSFER ENHANCEMENT OF HEAT SINK USING PLATE AND PIN FINS." International Journal of Advance Research and Innovative Ideas In Education 2, no. 1 (2016): 224-228.

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