A REVIEW ON THERMAL CONDUCTIVITY OF EPOXY–CERAMIC NANOCOMPOSITE

May 2019
Vol-5, Issue-3
Paper ID: 10345
ISSN: 2395-4396
Downloads: 0

Abstract & Details

Research Area
THERMAL ENGINEERING
Keywords
Thermal conductivity (TC) Thermal interface material (TIM) Thermally conductive fillers Epoxy resin Thermo-gravimetric analysis (TGA).
Abstract
Thermal management has become a serious problem with the development of electronics, where thermal interface material (TIM) is crucial for heat transfer from the device to heat sink. Addressing this challenge requires the development of new composite materials with enhanced thermal conductivity. Epoxy resin is one of that and it has been widely used in electrical and electronics industries due to its excellent adhesion and insulating properties. The past researches show that the internalization of filler materials of high thermal conductivity improves the thermal conductivity of epoxy composites, consequently improves the heat transfer in electronic devices. In this review paper the need of thermal interface material and epoxy as a thermal interface material are discussed.

Author Information

# Name Institute / Affiliation
1 CHHABI RAM SAHU GOVT. ENGINEERING COLLEGE, JAGDALPUR (C.G.)
2 DILBAG MONDLOE GOVT. ENGINEERING COLLEGE, JAGDALPUR (C.G.)
3 Ajay Singh paikra GOVT. ENGINEERING COLLEGE, JAGDALPUR (C.G.)

How to Cite

Use the following formats to cite this article in your research.

APA Style
SAHU, CHHABI RAM, MONDLOE, DILBAG, & paikra, Ajay Singh (2019). A REVIEW ON THERMAL CONDUCTIVITY OF EPOXY–CERAMIC NANOCOMPOSITE. International Journal of Advance Research and Innovative Ideas In Education, 5(3), 862-870.
MLA Style
SAHU, CHHABI RAM, et al. "A REVIEW ON THERMAL CONDUCTIVITY OF EPOXY–CERAMIC NANOCOMPOSITE." International Journal of Advance Research and Innovative Ideas In Education, vol. 5, no. 3, 2019, pp. 862-870.
IEEE Style
CHHABI RAM SAHU, DILBAG MONDLOE, and Ajay Singh paikra, "A REVIEW ON THERMAL CONDUCTIVITY OF EPOXY–CERAMIC NANOCOMPOSITE," International Journal of Advance Research and Innovative Ideas In Education, vol. 5, no. 3, pp. 862-870, 2019.
Vancouver Style
SAHU CHHABI RAM, MONDLOE DILBAG, paikra Ajay Singh. A REVIEW ON THERMAL CONDUCTIVITY OF EPOXY–CERAMIC NANOCOMPOSITE. International Journal of Advance Research and Innovative Ideas In Education. 2019;5(3):862-870.
Harvard Style
SAHU, CHHABI RAM, MONDLOE, DILBAG, & paikra, Ajay Singh (2019) 'A REVIEW ON THERMAL CONDUCTIVITY OF EPOXY–CERAMIC NANOCOMPOSITE', International Journal of Advance Research and Innovative Ideas In Education, 5(3), pp. 862-870.
Chicago Style
SAHU, CHHABI RAM, DILBAG MONDLOE, and Ajay Singh paikra. "A REVIEW ON THERMAL CONDUCTIVITY OF EPOXY–CERAMIC NANOCOMPOSITE." International Journal of Advance Research and Innovative Ideas In Education 5, no. 3 (2019): 862-870.
Turabian Style
SAHU, CHHABI RAM, DILBAG MONDLOE, and Ajay Singh paikra. "A REVIEW ON THERMAL CONDUCTIVITY OF EPOXY–CERAMIC NANOCOMPOSITE." International Journal of Advance Research and Innovative Ideas In Education 5, no. 3 (2019): 862-870.

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