Assessment of Thermal Resistance on Brass Material of Electronic Packages
Abstract & Details
Research Area
Mechanical Engineering
Keywords
TIM
Thermal resistances
heat transfer
Thermocouples
surface topography
Abstract
Thermal Interface Materials (TIMs) play a key role in the thermal management of microelectronics devices by providing a path of low thermal impedance between heat generating devices. TIMs provide mechanical coupling between the silicon device and the heat spreader sink. During device operation, the adhesive joint between the heat generating device and heat spreader sink is subjected to thermos mechanical stresses due to differences in thermal expansion coefficients of the silicone device and the heat spreader material. The adhesive joint can consequently de laminate the mating surfaces causing a significant increase in thermal impedance across the thermal interface material. TIMs offers improved thermal performance as well as enhanced reliability. In this present work experimentation carried out for different thickness of Brass plates with different loading conditions to determine the thermal resistance.
License
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Author Information
| # | Name | Institute / Affiliation |
|---|---|---|
| 1 | Roshan Manoj AK | Alvas Institute of Engineering and Technology |
| 2 | Abhilash C | Alvas Institute of Engineering and Technology |
| 3 | Prasanna H S | Alvas Institute of Engineering and Technology |
| 4 | Prathik P | Alvas Institute of Engineering and Technology |
How to Cite
Use the following formats to cite this article in your research.
APA Style
AK, Roshan Manoj, C, Abhilash, S, Prasanna H, & P, Prathik (2019). Assessment of Thermal Resistance on Brass Material of Electronic Packages. International Journal of Advance Research and Innovative Ideas In Education, 5(2), 3202-3205.
MLA Style
AK, Roshan Manoj, et al. "Assessment of Thermal Resistance on Brass Material of Electronic Packages." International Journal of Advance Research and Innovative Ideas In Education, vol. 5, no. 2, 2019, pp. 3202-3205.
IEEE Style
Roshan Manoj AK, Abhilash C, Prasanna H S, and Prathik P, "Assessment of Thermal Resistance on Brass Material of Electronic Packages," International Journal of Advance Research and Innovative Ideas In Education, vol. 5, no. 2, pp. 3202-3205, 2019.
Vancouver Style
AK Roshan Manoj, C Abhilash, S Prasanna H, P Prathik. Assessment of Thermal Resistance on Brass Material of Electronic Packages. International Journal of Advance Research and Innovative Ideas In Education. 2019;5(2):3202-3205.
Harvard Style
AK, Roshan Manoj, C, Abhilash, S, Prasanna H, & P, Prathik (2019) 'Assessment of Thermal Resistance on Brass Material of Electronic Packages', International Journal of Advance Research and Innovative Ideas In Education, 5(2), pp. 3202-3205.
Chicago Style
AK, Roshan Manoj, et al. "Assessment of Thermal Resistance on Brass Material of Electronic Packages." International Journal of Advance Research and Innovative Ideas In Education 5, no. 2 (2019): 3202-3205.
Turabian Style
AK, Roshan Manoj, et al. "Assessment of Thermal Resistance on Brass Material of Electronic Packages." International Journal of Advance Research and Innovative Ideas In Education 5, no. 2 (2019): 3202-3205.
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