Thermal analysis to estimate heat transfer from heat sink by natural convection through closed enclosure

Mechanical Engineering

2nd National Conference on Recent Trends & Innovations in Mechanical Engineering

Electronic devices are strategic devices such as radars, communication sets, and amplifiers, twt’s controls which are used in aircraft, space vehicles, missiles and ground stations. The use of these devices in strategic and military application is rapidly increasing and these equipments are becoming more and more sophisticated. Plate fin heat sinks are commonly used devices for enhancing heat transfer in electronics components. In this thesis, investigations will be carried out to determine the heat transfer rates in a heat sink by means of varying pitch of the fin with air as the working fluid. Analysis is carried out for heat sink with closed enclosure constant wall heat flux. Analysis is done with Aluminum alloy 6061, where Aluminum alloy 6061 was having highest temperature, heat transfer coefficient and better efficiency values. PRO-E is used for the modeling of plate fins. Analysis is performed in ANSYS software. CFD analysis is performed for different cases to determine heat transfer coefficient, pressure drop, mass flow rate and heat transfer rate. From the analysis done on the mentioned softwares finally we get the results of pressure, velocity and heat transfer coefficient values for Reynolds number 8000 and 14000

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