SIMULATION OF THERMAL WING AND MODELISATION OF A THERMOACOUSTIC ENGINES

Science, Engineering and Technology

Any semiconductor component admits a maximum temperature of operation, called maximum temperature of junction, depend on the type of material used and technology of realization. This maximum temperature of junction remains a significant data since it is it which makes it possible to consider the level of cooling necessary to the correct operation of the component.explanation. To cool an electronic component of power, a thermal wing is necessary; in this thesis, initially, one studied the behavior theoretical and physical of this wing and finally of simulations were made by using a model of wing designed with COMSOL Multiphysics 4.3. In the second time, we saw the other techniques of cooling, that is to say directly one changing the physical properties of the component itself, for example in the case of a structure RC - IGBT with bands P+ and NR + alternate by simulating it in 2d on the software Sentaurus™ TCAD, amongst other things, a study by simulation of new structures of cooling containing diamond CVD (Chemical Vapor Deposition) is also possible, simulation it is also possible to make an approach by cooling by thermoacoustic on this our study focuses itself on the difficulties met if one deals with nonlinear wave and with the possibility of reducing on a small scale the thermoacoustic engines.

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